SiEtch Silicon Etch Solutions
RENA's SiEtch, Silicon Etch Advanced KOH Solution
Features and Benefits:
- Etch rate uniformity
- Etch rate stability
- Short bath life
- DI water concentration
- KOH (potassium hydroxide) concentration
- Silicate buildup
- Bleed and feed
- Etch endpoint software control
- Process time etch algorithm corrections
- Hardware component life
Tank Design – Etch Rate Uniformity
- Tank and Collar materials and design- Cost and Performance
- Nitrogen Injection dispersion plates
- Best Temperature Control
- KOH ports w/ flow regulation
Concentration Controls
Etch rate stability, Endpoint control
- Software-controlled KOH spiking algorithm used with the DI loss sensor to maintain KOH concentration
- Feed and bleed chemical controls
- KOH spike reservoirs
- IDX software controlled by closed-loop feedback
- In line KOH concentration sensor
- Concentration control by closed-loop sensor feedback
DI Concentration Controls
Etch rate stability
- Accurate Concentration Control
- Accurate Chemical & DI Spiking
- Consumption/Evaporation Compensation
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We are happy to help our customers find efficient and process-optimized solutions for their wet processing applications.