Inception Single Wafer Processing Tool
Clean, Etch, Strip & Dry - Enabling the Transition from R&D to Pilot Production
Features and Benefits:
- Provides process consistency to develop your POR
- FEoL (Acid) & BEoL (Solvent) processing applications
- Automated Wafer Handling (Manual Load Optional)
- Wafers up to 200mm and masks up to 7 x 7
- Dual moving spray arms with separate chem lines
- Stationary bottom spray nozzles for DI and N2Etch uniformity exceeds batch systems
- Stationary bottom spray nozzles for DI and N2
- Standard dual tank design provides multi-step processing
- 4-tank optional
- Manual or automated wafer handling
- Single or dual load ports
- Low utility consumption
- Small Footprint Dimensions – 36″w x 83″h x 76″l
- Highly flexible software enables rapid process development
No Contamination
- Particle neutralIonic contamination less than < 1E10
Etch Stability Concentration Control
- Hyper accurate concentration controls (ABB, Horiba, CI Semi)
- Hyper accurate spiking capability (Chemical & DI)
- Automatic compensation for losses due to consumption and evaporation
Superior Etch Uniformity
- 75mm–200mm EPI Materials
- Wafer to wafer < = 1%
- Within wafer < = 1%
- Lot to lot < = 1%
Superior Process Control
- Data logging by Lot ID
- Flexview APC monitoring
- SECS/GEM compliant host
- Unlimited user/permission levels
- Easy-to-use, touch-screen interface
- Error logging and data graphing
- Unlimited recipes, speeds, chem control
- Barcode reader compatibility
- Remote access compatible
Proven Reliability
- MTBF > 1500 hr (Semi E10-94)
- Avg MTTR < 1 hrHigher uptime > 97%
- Reduced scrap
Control
- Analog sensing enables software to control: In-tank blending
- Precision ratio creation
- Precision DI water inject
- Tight temperature control
- Closed loop recirculation flow
- Hyper accurate chemical spiking controls
Contact our Experts
We are happy to help our customers find efficient and process-optimized solutions for their wet processing applications.